ASML CEO says Samsung to use High-NA EUV in high-volume manufacturing in 2028, TSMC around 2030

ASML CEO revealed that Samsung will use High-NA EUV in high-volume manufacturing in 2028, TSMC around 2030, and Intel is already increasing layers and wafer volume. He noted the High-NA program started more than 10 years ago and customers are now about to adopt it.

Detected & updated continuously · Source: Nebula