GlobalFoundries signs $2B, five-year deal with TSMC to supply U.S.-based silicon interposers for CoWoS packaging

GlobalFoundries has signed a $2 billion, five-year deal with TSMC to make silicon interposers for CoWoS advanced packaging in New York — the first U.S. source of the AI-packaging component — with volume ramp beginning in the first half of 2028.

Detected & updated continuously · Source: Nebula