Intel Foundry and ASML confirm High NA EUV in high-volume manufacturing with 1M+ wafers processed
Intel Foundry and ASML announced that High NA EUV lithography is now being used in high-volume manufacturing, with more than 1 million wafers processed and select Panther Lake layers already in production. Intel also reported that High NA on its 18A node meets or exceeds the performance of comparable layers versus NXE (0.33 NA) tools, while ASML and TSMC are pushing EUV masks from 6 inches to 12 inches as High NA moves toward high-volume manufacturing.
Detected & updated continuously · Source: Nebula
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@RealChickenBoy9
$INTC High NA / ASML Intel Foundry–ASML High NA 업데이트 High NA HVM 진행, 누적 100만장+ 웨이퍼 (인증·R&D·Panther Lake 일부 레이어) 18A 선택 레이어 성능 NXE(0.33 NA) 대비 동등 이상 현행 6인치 마스크(플로어플랜·스티칭)로 High NA 가능, 6x12 대형 마스크 이니셔티브 지속
@Sam_Badawi
$INTC Intel Foundry and $ASML say High NA EUV is now being used in high-volume manufacturing, with more than 1M wafers processed and select Panther Lake layers already in production. Intel also says High NA on 18A is meeting or exceeding the performance of comparable layers https://t.co/B1kIE9HRM5
@StockSavvyShay
$ASML and $TSM are pushing EUV masks from 6 inches to 12 inches as High NA moves toward high volume manufacturing. The larger format could improve fab productivity and remove stitching constraints as AI chips get much more complex. https://t.co/1VhWqaSuQi