Jensen Huang says NVIDIA remains supply-constrained across wafers, packaging, DRAM, connectors and power
At the Goldman Sachs Communacopia event on September 10, NVIDIA CEO Jensen Huang said the company remains constrained across wafers, packaging, DRAM, connectors and power components, describing "everything is challenging." He also said over $3 trillion is heading into AI infrastructure by 2030.
Detected & updated continuously · Source: Nebula
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@StockSavvyShay
Jensen Huang says $NVDA is still constrained across wafers, packaging, DRAM, connectors and power components saying “everything is challenging.” AI demand is now putting pressure across almost every layer of the hardware stack at the same time. https://t.co/uF4w70Fozk
@YahooFinance
Jensen Huang wants his flowers. 💐 Opening his fireside chat at the Goldman Sachs Communacopia event, Huang pointed out that he was right on track: over $3 trillion is heading into AI infrastructure by 2030. https://t.co/FNXlkkBe5I