SK Hynix breaks ground on $4B HBM advanced packaging facility in Indiana
SK Hynix held a groundbreaking ceremony on August 27, 2026 for its $4 billion advanced HBM packaging facility in Indiana, with next-generation memory mass production targeted for the second half of 2029. The facility is expected to significantly speed up US memory operations, with wafers constructed in Korea and shipped to the Indiana site.
Detected & updated continuously · Source: Nebula
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@blckchaindaily
🚨 SK HYNIX BREAKS GROUND ON $4B INDIANA HBM ADVANCED PACKAGING FAB; FIRST US NEXT-GEN HBM MASS PRODUCTION SEEN IN H2 2029 - PRESS RELEASE
@stocksnipa
SK Hynix $SKHY has began construction on their US high bandwidth memory packaging facility🧠🇺🇸 It’s located in Indiana & is expected to cost $4B, this will significantly speed up US memory operations They are planning to construct the wafers in Korea, send them to this https://t.co/n0KL3vlxmC
@StockMKTNewz
SK Hynix $SKHY today held a groundbreaking ceremony today for its $4 Billion advanced memory packaging facility in Indiana - Bloomberg https://t.co/6oSTfmTwXg
@PolymarketMoney
JUST IN: SK Hynix has broken ground on a $4,000,000,000.00 U.S. HBM facility in Indiana, with next-generation memory production targeted for the second half of 2029.